By Chuan Seng Tan,Kuan-Neng Chen,Steven J. Koester
Three-dimensional (3D) integration is pointed out as a potential street for non-stop functionality progress in built-in circuits (IC) because the traditional scaling method is confronted with exceptional demanding situations in primary and fiscal limits. Wafer point 3D IC can take a number of kinds, and so they often contain a stack of numerous thinned IC layers which are vertically bonded and interconnected through via silicon through TSV.
There is an extended string of advantages that it is easy to derive from 3D IC implementation akin to shape issue, density multiplication, more suitable hold up and tool, stronger bandwidth, and heterogeneous integration. This booklet provides contributions by means of key researchers during this box, protecting motivations, expertise systems, purposes, and different layout concerns.
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3D Integration for VLSI Systems by Chuan Seng Tan,Kuan-Neng Chen,Steven J. Koester